TY - GEN
T1 - A tileable switch module architecture for homogeneous 3D FPGAs
AU - Razavi, Seyyed Ahmad
AU - Zamani, Morteza Saheb
AU - Bazargan, Kia
PY - 2009
Y1 - 2009
N2 - 3D technology is an attractive solution for reducing wirelength in a field programmable gate array (FPGA). However, trough silicon vias (TSV) are limited in number. In this paper, we propose a tilable switch module architecture based on the 3D disjoint switch module for 3D FPGAs. Experimental results over 20 MCNC benchmarks show 62% reduction in the number of TSVs on average and small improvements in horizontal channel width and delay compared to the original 3D disjoint SM.
AB - 3D technology is an attractive solution for reducing wirelength in a field programmable gate array (FPGA). However, trough silicon vias (TSV) are limited in number. In this paper, we propose a tilable switch module architecture based on the 3D disjoint switch module for 3D FPGAs. Experimental results over 20 MCNC benchmarks show 62% reduction in the number of TSVs on average and small improvements in horizontal channel width and delay compared to the original 3D disjoint SM.
UR - http://www.scopus.com/inward/record.url?scp=70549086028&partnerID=8YFLogxK
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U2 - 10.1109/3DIC.2009.5306586
DO - 10.1109/3DIC.2009.5306586
M3 - Conference contribution
AN - SCOPUS:70549086028
SN - 9781424445127
T3 - 2009 IEEE International Conference on 3D System Integration, 3DIC 2009
BT - 2009 IEEE International Conference on 3D System Integration, 3DIC 2009
T2 - 2009 IEEE International Conference on 3D System Integration, 3DIC 2009
Y2 - 28 September 2009 through 30 September 2009
ER -