Characterization of micromachined transitions for high-speed integrated packages

Rhonda Franklin Drayton; S. Riki Banerjee; Jeremy L. Haley

doi:10.1109/TAP.2002.1011236

Characterization of micromachined transitions for high-speed integrated packages

Rhonda Franklin Drayton, S. Riki Banerjee, Jeremy L. Haley

Electrical and Computer Engineering

Research output: Contribution to journal › Article › peer-review

2 Scopus citations

Abstract

Micromachined transitions are characterized with abrupt and taper dielectric and conductor discontinuities. Constant impedance designs are studied for interconnects printed on the same substrate that traverse two different substrate heights. The best transition, when compared to the constant height design, has better than 20 dB return loss over 40 GHz. Its effective dielectric constant variation is less than 0.25 dB across the bandwidth, which indicates a low dispersion interconnect design with a micromachined transition.

Original language	English (US)
Pages (from-to)	693-697
Number of pages	5
Journal	IEEE Transactions on Antennas and Propagation
Volume	50
Issue number	5
DOIs	https://doi.org/10.1109/TAP.2002.1011236
State	Published - May 2002

Bibliographical note

Funding Information:
Manuscript received July 26, 2001; revised January 18, 2002. This work was supported by the National Science Foundation’s Presidential Early Career Award for Scientists and Engineers Award ECS-9996017. The authors are with the Department of Electrical and Computer Engineering, University of Minnesota, 200 Union Street St. S.E., Minneapolis, MN 55455 USA (e-mail: drayton@ece.umn.edu). Publisher Item Identifier S 0018-926X(02)05462-5.

Keywords

Integrated circuit packaging
Micromachining
Microstrip transitions

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

Access

10.1109/TAP.2002.1011236

OpenUrl availability

Full text

Cite this

@article{6a18d4215d3f40e1825be6c2e3135dda,

title = "Characterization of micromachined transitions for high-speed integrated packages",

abstract = "Micromachined transitions are characterized with abrupt and taper dielectric and conductor discontinuities. Constant impedance designs are studied for interconnects printed on the same substrate that traverse two different substrate heights. The best transition, when compared to the constant height design, has better than 20 dB return loss over 40 GHz. Its effective dielectric constant variation is less than 0.25 dB across the bandwidth, which indicates a low dispersion interconnect design with a micromachined transition.",

keywords = "Integrated circuit packaging, Micromachining, Microstrip transitions",

author = "Drayton, {Rhonda Franklin} and {Riki Banerjee}, S. and Haley, {Jeremy L.}",

note = "Funding Information: Manuscript received July 26, 2001; revised January 18, 2002. This work was supported by the National Science Foundation{\textquoteright}s Presidential Early Career Award for Scientists and Engineers Award ECS-9996017. The authors are with the Department of Electrical and Computer Engineering, University of Minnesota, 200 Union Street St. S.E., Minneapolis, MN 55455 USA (e-mail: drayton@ece.umn.edu). Publisher Item Identifier S 0018-926X(02)05462-5.",

year = "2002",

month = may,

doi = "10.1109/TAP.2002.1011236",

language = "English (US)",

volume = "50",

pages = "693--697",

journal = "IEEE Transactions on Antennas and Propagation",

issn = "0018-926X",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

number = "5",

}

TY - JOUR

T1 - Characterization of micromachined transitions for high-speed integrated packages

AU - Drayton, Rhonda Franklin

AU - Riki Banerjee, S.

AU - Haley, Jeremy L.

N1 - Funding Information: Manuscript received July 26, 2001; revised January 18, 2002. This work was supported by the National Science Foundation’s Presidential Early Career Award for Scientists and Engineers Award ECS-9996017. The authors are with the Department of Electrical and Computer Engineering, University of Minnesota, 200 Union Street St. S.E., Minneapolis, MN 55455 USA (e-mail: drayton@ece.umn.edu). Publisher Item Identifier S 0018-926X(02)05462-5.

PY - 2002/5

Y1 - 2002/5

N2 - Micromachined transitions are characterized with abrupt and taper dielectric and conductor discontinuities. Constant impedance designs are studied for interconnects printed on the same substrate that traverse two different substrate heights. The best transition, when compared to the constant height design, has better than 20 dB return loss over 40 GHz. Its effective dielectric constant variation is less than 0.25 dB across the bandwidth, which indicates a low dispersion interconnect design with a micromachined transition.

AB - Micromachined transitions are characterized with abrupt and taper dielectric and conductor discontinuities. Constant impedance designs are studied for interconnects printed on the same substrate that traverse two different substrate heights. The best transition, when compared to the constant height design, has better than 20 dB return loss over 40 GHz. Its effective dielectric constant variation is less than 0.25 dB across the bandwidth, which indicates a low dispersion interconnect design with a micromachined transition.

KW - Integrated circuit packaging

KW - Micromachining

KW - Microstrip transitions

UR - http://www.scopus.com/inward/record.url?scp=0036564362&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0036564362&partnerID=8YFLogxK

U2 - 10.1109/TAP.2002.1011236

DO - 10.1109/TAP.2002.1011236

M3 - Article

AN - SCOPUS:0036564362

SN - 0018-926X

VL - 50

SP - 693

EP - 697

JO - IEEE Transactions on Antennas and Propagation

JF - IEEE Transactions on Antennas and Propagation

IS - 5

ER -

Characterization of micromachined transitions for high-speed integrated packages

Abstract

Bibliographical note

Keywords

UN SDGs

Access

OpenUrl availability

Other files and links

Fingerprint

Cite this