High frequency circuit components on micromachined variable thickness substrates

R. F. Drayton; R. M. Henderson; L. P.B. Katehi

doi:10.1049/el:19970221

High frequency circuit components on micromachined variable thickness substrates

R. F. Drayton, R. M. Henderson, L. P.B. Katehi

Research output: Contribution to journal › Article › peer-review

5 Scopus citations

Abstract

The use of Si micromachining techniques to enhance high frequency planar circuit design flexibility by offering a method for varying the substrate thickness in selective locations on the wafer is presented.

Original language	English (US)
Pages (from-to)	303-304
Number of pages	2
Journal	Electronics Letters
Volume	33
Issue number	4
DOIs	https://doi.org/10.1049/el:19970221
State	Published - Feb 13 1997
Externally published	Yes

Keywords

Micromachining
Microwave circuits
Silicon

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title = "High frequency circuit components on micromachined variable thickness substrates",

abstract = "The use of Si micromachining techniques to enhance high frequency planar circuit design flexibility by offering a method for varying the substrate thickness in selective locations on the wafer is presented.",

keywords = "Micromachining, Microwave circuits, Silicon",

author = "Drayton, {R. F.} and Henderson, {R. M.} and Katehi, {L. P.B.}",

year = "1997",

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doi = "10.1049/el:19970221",

language = "English (US)",

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journal = "Electronics Letters",

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T1 - High frequency circuit components on micromachined variable thickness substrates

AU - Drayton, R. F.

AU - Henderson, R. M.

AU - Katehi, L. P.B.

PY - 1997/2/13

Y1 - 1997/2/13

N2 - The use of Si micromachining techniques to enhance high frequency planar circuit design flexibility by offering a method for varying the substrate thickness in selective locations on the wafer is presented.

AB - The use of Si micromachining techniques to enhance high frequency planar circuit design flexibility by offering a method for varying the substrate thickness in selective locations on the wafer is presented.

KW - Micromachining

KW - Microwave circuits

KW - Silicon

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DO - 10.1049/el:19970221

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JO - Electronics Letters

JF - Electronics Letters

IS - 4

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High frequency circuit components on micromachined variable thickness substrates

Abstract

Keywords

UN SDGs

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