MEASUREMENT OF THE THERMO‐PHYSICAL PROPERTIES OF COMMON COOKIE DOUGH

Despite the volume of research done on food properties, the literature reports little related to the baking industry, particularly confectionary dough. This paper reports results of an experimental study of thermal conductivity, specific heat, density and thermal diffusivity of two different types of cookie dough. Thermal conductivity of both doughs were moderately dependent on temperature. Thermal diffusivities of each type dough were evaluated using experimental values of thermal conductivity, specific heat and density. Total experimental uncertainty in the thermal diffusivity was estimated as 0.134 for the AACC formula and 0.15 for the hard‐sweet formula dough.