Novel methodology for temperature-aware electromigration assessment in on-chip power grid: simulations and experimental validation (Invited)

A. Kteyan, V. Sukharev, Y. Yi, C. Kim

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Scopus citations

Fingerprint

Dive into the research topics of 'Novel methodology for temperature-aware electromigration assessment in on-chip power grid: simulations and experimental validation (Invited)'. Together they form a unique fingerprint.

Engineering & Materials Science