TY - GEN
T1 - Physical design automation challenges for 3D ICs
AU - Sapatnekar, Sachin S.
PY - 2006
Y1 - 2006
N2 - Recent advances in process technology have brought forth several options that have brought three-dimensional (3D) circuits within the realm of the possible and probable. This new design paradigm will require a major change in design methodologies, and an optimal 3D design will look very different from an optimal 2D design. Since the move from conventional 2D to 3D is inherently a topological change, it stands to reason that a number of SD-specific problems lie in the domain of physical design. This paper addresses challenges related to physical design for 3D integrated circuits.
AB - Recent advances in process technology have brought forth several options that have brought three-dimensional (3D) circuits within the realm of the possible and probable. This new design paradigm will require a major change in design methodologies, and an optimal 3D design will look very different from an optimal 2D design. Since the move from conventional 2D to 3D is inherently a topological change, it stands to reason that a number of SD-specific problems lie in the domain of physical design. This paper addresses challenges related to physical design for 3D integrated circuits.
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U2 - 10.1109/icicdt.2006.220820
DO - 10.1109/icicdt.2006.220820
M3 - Conference contribution
AN - SCOPUS:42749104013
SN - 1424400988
SN - 9781424400980
T3 - 2006 IEEE International Conference on Integrated Circuit Design and Technology, ICICDT'06
BT - 2006 IEEE International Conference on Integrated Circuit Design and Technology, ICICDT'06
PB - IEEE Computer Society
T2 - Integrated Circuit Design and Technology, 2006. ICICDT '06. 2006 IEEE International Conference
Y2 - 24 May 2006 through 26 May 2006
ER -