Polymer-sandwiched ultra-thin silicon(100) layer for flexible electronics

Yong Hua Zhang; Stephen A. Campbell; Liyuan Zhang

doi:10.1109/BMEI.2015.7401531

Polymer-sandwiched ultra-thin silicon(100) layer for flexible electronics

Yong Hua Zhang, Stephen A. Campbell, Liyuan Zhang

Electrical and Computer Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Scopus citations

Abstract

Flexible electronics has gained increasing attention for biomedical engineering applications, solar cell and so on. In this paper, an SU-8/silicon(100)/SU-8 flexible composite sandwich structure is studied. Besides preventing corrosion to the underneath thin silicon membrane, SU-8 photoresist coated on the silicon membrane improves its flexibility as shown by a finite element (FE) simulation utilizing ANSYS software. Using plasma enhanced chemical vapor deposited SiO2/Si3N4 composite film as an etching mask, a 4" silicon(100) wafer was thinned to 26μm without rupture in a 30 wt.% KOH solution. The thinned wafer was coated on both sides with 20μm of SU-8 photoresist and cut into strips. And then the strips were bent by a caliper to measure its radius of curvature. A sector model of bending deformation was adopted to estimate the radius of curvature. The determined minimal bending radius of the polymer-sandwiched ultra-thin silicon layer is no more than 3.3mm. The polymer-sandwiched ultra-thin silicon(100) layer can be used as a flexible substrate. And the fabrication of this sandwich structure is compatible with conventional microelectronic fabrication processing. It can be used as a post-fabrication process for high performance flexible electronics.

Original language	English (US)
Title of host publication	Proceedings - 2015 8th International Conference on BioMedical Engineering and Informatics, BMEI 2015
Editors	Zhiyong Tao, Li Bai, Sen Lin, Jinguang Sun, Lipo Wang, Liangshan Shao
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	366-370
Number of pages	5
ISBN (Electronic)	9781509000227
DOIs	https://doi.org/10.1109/BMEI.2015.7401531
State	Published - Feb 8 2016
Event	8th International Conference on BioMedical Engineering and Informatics, BMEI 2015 - Shenyang, China Duration: Oct 14 2015 → Oct 16 2015

Publication series

Name	Proceedings - 2015 8th International Conference on BioMedical Engineering and Informatics, BMEI 2015

Other

Other	8th International Conference on BioMedical Engineering and Informatics, BMEI 2015
Country/Territory	China
City	Shenyang
Period	10/14/15 → 10/16/15

Bibliographical note

Publisher Copyright:
© 2015 IEEE.

Keywords

SU-8 photoresist
bulk silicon (100)
flexible electronic technology
micro-electro-mechanical systems
sandwich structure

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

Access

10.1109/BMEI.2015.7401531

OpenUrl availability

Full text

Cite this

Zhang, Y. H., Campbell, S. A., & Zhang, L. (2016). Polymer-sandwiched ultra-thin silicon(100) layer for flexible electronics. In Z. Tao, L. Bai, S. Lin, J. Sun, L. Wang, & L. Shao (Eds.), Proceedings - 2015 8th International Conference on BioMedical Engineering and Informatics, BMEI 2015 (pp. 366-370). Article 7401531 (Proceedings - 2015 8th International Conference on BioMedical Engineering and Informatics, BMEI 2015). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/BMEI.2015.7401531

Polymer-sandwiched ultra-thin silicon(100) layer for flexible electronics. / Zhang, Yong Hua; Campbell, Stephen A.; Zhang, Liyuan.
Proceedings - 2015 8th International Conference on BioMedical Engineering and Informatics, BMEI 2015. ed. / Zhiyong Tao; Li Bai; Sen Lin; Jinguang Sun; Lipo Wang; Liangshan Shao. Institute of Electrical and Electronics Engineers Inc., 2016. p. 366-370 7401531 (Proceedings - 2015 8th International Conference on BioMedical Engineering and Informatics, BMEI 2015).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Zhang, YH, Campbell, SA & Zhang, L 2016, Polymer-sandwiched ultra-thin silicon(100) layer for flexible electronics. in Z Tao, L Bai, S Lin, J Sun, L Wang & L Shao (eds), Proceedings - 2015 8th International Conference on BioMedical Engineering and Informatics, BMEI 2015., 7401531, Proceedings - 2015 8th International Conference on BioMedical Engineering and Informatics, BMEI 2015, Institute of Electrical and Electronics Engineers Inc., pp. 366-370, 8th International Conference on BioMedical Engineering and Informatics, BMEI 2015, Shenyang, China, 10/14/15. https://doi.org/10.1109/BMEI.2015.7401531

Zhang YH, Campbell SA, Zhang L. Polymer-sandwiched ultra-thin silicon(100) layer for flexible electronics. In Tao Z, Bai L, Lin S, Sun J, Wang L, Shao L, editors, Proceedings - 2015 8th International Conference on BioMedical Engineering and Informatics, BMEI 2015. Institute of Electrical and Electronics Engineers Inc. 2016. p. 366-370. 7401531. (Proceedings - 2015 8th International Conference on BioMedical Engineering and Informatics, BMEI 2015). doi: 10.1109/BMEI.2015.7401531

Zhang, Yong Hua ; Campbell, Stephen A. ; Zhang, Liyuan. / Polymer-sandwiched ultra-thin silicon(100) layer for flexible electronics. Proceedings - 2015 8th International Conference on BioMedical Engineering and Informatics, BMEI 2015. editor / Zhiyong Tao ; Li Bai ; Sen Lin ; Jinguang Sun ; Lipo Wang ; Liangshan Shao. Institute of Electrical and Electronics Engineers Inc., 2016. pp. 366-370 (Proceedings - 2015 8th International Conference on BioMedical Engineering and Informatics, BMEI 2015).

@inproceedings{dcb9cb4b83ec423e9985d2ac58edb528,

title = "Polymer-sandwiched ultra-thin silicon(100) layer for flexible electronics",

abstract = "Flexible electronics has gained increasing attention for biomedical engineering applications, solar cell and so on. In this paper, an SU-8/silicon(100)/SU-8 flexible composite sandwich structure is studied. Besides preventing corrosion to the underneath thin silicon membrane, SU-8 photoresist coated on the silicon membrane improves its flexibility as shown by a finite element (FE) simulation utilizing ANSYS software. Using plasma enhanced chemical vapor deposited SiO2/Si3N4 composite film as an etching mask, a 4{"} silicon(100) wafer was thinned to 26μm without rupture in a 30 wt.% KOH solution. The thinned wafer was coated on both sides with 20μm of SU-8 photoresist and cut into strips. And then the strips were bent by a caliper to measure its radius of curvature. A sector model of bending deformation was adopted to estimate the radius of curvature. The determined minimal bending radius of the polymer-sandwiched ultra-thin silicon layer is no more than 3.3mm. The polymer-sandwiched ultra-thin silicon(100) layer can be used as a flexible substrate. And the fabrication of this sandwich structure is compatible with conventional microelectronic fabrication processing. It can be used as a post-fabrication process for high performance flexible electronics.",

keywords = "SU-8 photoresist, bulk silicon (100), flexible electronic technology, micro-electro-mechanical systems, sandwich structure",

author = "Zhang, {Yong Hua} and Campbell, {Stephen A.} and Liyuan Zhang",

note = "Publisher Copyright: {\textcopyright} 2015 IEEE.; 8th International Conference on BioMedical Engineering and Informatics, BMEI 2015 ; Conference date: 14-10-2015 Through 16-10-2015",

year = "2016",

month = feb,

day = "8",

doi = "10.1109/BMEI.2015.7401531",

language = "English (US)",

series = "Proceedings - 2015 8th International Conference on BioMedical Engineering and Informatics, BMEI 2015",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "366--370",

editor = "Zhiyong Tao and Li Bai and Sen Lin and Jinguang Sun and Lipo Wang and Liangshan Shao",

booktitle = "Proceedings - 2015 8th International Conference on BioMedical Engineering and Informatics, BMEI 2015",

}

TY - GEN

T1 - Polymer-sandwiched ultra-thin silicon(100) layer for flexible electronics

AU - Zhang, Yong Hua

AU - Campbell, Stephen A.

AU - Zhang, Liyuan

PY - 2016/2/8

Y1 - 2016/2/8

N2 - Flexible electronics has gained increasing attention for biomedical engineering applications, solar cell and so on. In this paper, an SU-8/silicon(100)/SU-8 flexible composite sandwich structure is studied. Besides preventing corrosion to the underneath thin silicon membrane, SU-8 photoresist coated on the silicon membrane improves its flexibility as shown by a finite element (FE) simulation utilizing ANSYS software. Using plasma enhanced chemical vapor deposited SiO2/Si3N4 composite film as an etching mask, a 4" silicon(100) wafer was thinned to 26μm without rupture in a 30 wt.% KOH solution. The thinned wafer was coated on both sides with 20μm of SU-8 photoresist and cut into strips. And then the strips were bent by a caliper to measure its radius of curvature. A sector model of bending deformation was adopted to estimate the radius of curvature. The determined minimal bending radius of the polymer-sandwiched ultra-thin silicon layer is no more than 3.3mm. The polymer-sandwiched ultra-thin silicon(100) layer can be used as a flexible substrate. And the fabrication of this sandwich structure is compatible with conventional microelectronic fabrication processing. It can be used as a post-fabrication process for high performance flexible electronics.

AB - Flexible electronics has gained increasing attention for biomedical engineering applications, solar cell and so on. In this paper, an SU-8/silicon(100)/SU-8 flexible composite sandwich structure is studied. Besides preventing corrosion to the underneath thin silicon membrane, SU-8 photoresist coated on the silicon membrane improves its flexibility as shown by a finite element (FE) simulation utilizing ANSYS software. Using plasma enhanced chemical vapor deposited SiO2/Si3N4 composite film as an etching mask, a 4" silicon(100) wafer was thinned to 26μm without rupture in a 30 wt.% KOH solution. The thinned wafer was coated on both sides with 20μm of SU-8 photoresist and cut into strips. And then the strips were bent by a caliper to measure its radius of curvature. A sector model of bending deformation was adopted to estimate the radius of curvature. The determined minimal bending radius of the polymer-sandwiched ultra-thin silicon layer is no more than 3.3mm. The polymer-sandwiched ultra-thin silicon(100) layer can be used as a flexible substrate. And the fabrication of this sandwich structure is compatible with conventional microelectronic fabrication processing. It can be used as a post-fabrication process for high performance flexible electronics.

KW - SU-8 photoresist

KW - bulk silicon (100)

KW - flexible electronic technology

KW - micro-electro-mechanical systems

KW - sandwich structure

UR - http://www.scopus.com/inward/record.url?scp=84964344942&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84964344942&partnerID=8YFLogxK

U2 - 10.1109/BMEI.2015.7401531

DO - 10.1109/BMEI.2015.7401531

M3 - Conference contribution

AN - SCOPUS:84964344942

T3 - Proceedings - 2015 8th International Conference on BioMedical Engineering and Informatics, BMEI 2015

SP - 366

EP - 370

BT - Proceedings - 2015 8th International Conference on BioMedical Engineering and Informatics, BMEI 2015

A2 - Tao, Zhiyong

A2 - Bai, Li

A2 - Lin, Sen

A2 - Sun, Jinguang

A2 - Wang, Lipo

A2 - Shao, Liangshan

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 8th International Conference on BioMedical Engineering and Informatics, BMEI 2015

Y2 - 14 October 2015 through 16 October 2015

ER -

Polymer-sandwiched ultra-thin silicon(100) layer for flexible electronics

Abstract

Publication series

Other

Bibliographical note

Keywords

UN SDGs

Access

OpenUrl availability

Other files and links

Fingerprint

Cite this