TY - JOUR
T1 - Sandwich structure based on back-side etching silicon (100) wafers for flexible electronic technology
AU - Zhang, Yong hua
AU - Campbell, Stephen A.
AU - Zhang, Liyuan
AU - Karthikeyan, Sreejith
N1 - Publisher Copyright:
© 2015, Springer-Verlag Berlin Heidelberg.
PY - 2017/3/1
Y1 - 2017/3/1
N2 - An SU-8-silicon(100)-SU-8 flexible composite sandwich structure is studied. Besides preventing corrosion to the thin silicon membrane, SU-8 photoresist coated on the silicon membrane improves its flexibility as shown by an ANSYS finite element simulation. Using a plasma enhanced chemical vapor deposited SiO2/Si3N4 composite film as an etch mask on the polished side, a 4″ (100) silicon wafer was thinned to 26 µm without rupture in a 30 wt% KOH solution. The wafer was coated on both sides with 20 µm of SU-8 photoresist and then bent over cylinders with various diameters, to flex the sandwich in a controlled manner. The determined minimal bending radius of the fabricated thin silicon-based sandwich structure is approximately 3.5 mm. The fabrication of this sandwich structure is compatible with conventional microelectronic fabrication processing. Thus, it allows one to thin fully fabricated devices in a post-fabrication process to make high-performance flexible electronics.
AB - An SU-8-silicon(100)-SU-8 flexible composite sandwich structure is studied. Besides preventing corrosion to the thin silicon membrane, SU-8 photoresist coated on the silicon membrane improves its flexibility as shown by an ANSYS finite element simulation. Using a plasma enhanced chemical vapor deposited SiO2/Si3N4 composite film as an etch mask on the polished side, a 4″ (100) silicon wafer was thinned to 26 µm without rupture in a 30 wt% KOH solution. The wafer was coated on both sides with 20 µm of SU-8 photoresist and then bent over cylinders with various diameters, to flex the sandwich in a controlled manner. The determined minimal bending radius of the fabricated thin silicon-based sandwich structure is approximately 3.5 mm. The fabrication of this sandwich structure is compatible with conventional microelectronic fabrication processing. Thus, it allows one to thin fully fabricated devices in a post-fabrication process to make high-performance flexible electronics.
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U2 - 10.1007/s00542-015-2737-7
DO - 10.1007/s00542-015-2737-7
M3 - Article
AN - SCOPUS:84948949486
SN - 0946-7076
VL - 23
SP - 739
EP - 743
JO - Microsystem Technologies
JF - Microsystem Technologies
IS - 3
ER -