Abstract
Millimeter wave antenna-in-packages require miniaturized antennas with good performance for cellular and IOT applications. Coupling between antenna elements is a chief concern in small package sizes. This work proposes two antennain-package (AIP) approaches at 60 GHz for millimeter wave applications. First solution leverages via fences in a corporate-fed 2x2 slot array to miniaturize and decouple individual elements that occupies same area as the single unoptimized element. The second approach uses a vertical substrate integrated waveguide sandwiched between the source element and a metamaterial surface. Both approaches produce 78% aperture efficiency at 60 GHz and a gain of 12.5 dB, which is 6 dB more than the single element. The responses are validated in a X and Ku band anechoic chamber by scaling the structures to operate at 12 GHz.
| Original language | English (US) |
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| Title of host publication | 2022 IEEE 22nd Annual Wireless and Microwave Technology Conference, WAMICON 2022 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| ISBN (Electronic) | 9781665421959 |
| DOIs | |
| State | Published - 2022 |
| Externally published | Yes |
| Event | 22nd IEEE Annual Wireless and Microwave Technology Conference, WAMICON 2022 - Clearwater, United States Duration: Apr 27 2022 → Apr 28 2022 |
Publication series
| Name | 2022 IEEE 22nd Annual Wireless and Microwave Technology Conference, WAMICON 2022 |
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Conference
| Conference | 22nd IEEE Annual Wireless and Microwave Technology Conference, WAMICON 2022 |
|---|---|
| Country/Territory | United States |
| City | Clearwater |
| Period | 4/27/22 → 4/28/22 |
Bibliographical note
Funding Information:This work is partially supported by the IEEE Microwave Theory and Techniques MTT-SAT student grant program.
Publisher Copyright:
© 2022 IEEE.
Keywords
- antenna-in-package
- millimeter wave packaging
- partially reflective surface
- substrate integrated waveguide