Studying the Impact of Temperature Gradient on Electromigration Lifetime Using a Power Grid Test Structure with On-Chip Heaters

Yong Hyeon Yi, Chris Kim, Chen Zhou, Armen Kteyan, Valeriy Sukharev

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This work presents statistical data collected from 38 power grid test structures showing the detailed impact of temperature gradient on electro migration (EM) lifetime. The failure time, order, and location under different temperature gradients were compared to show that unexpected early EM failures can occur at temperature gradient regions due to accelerated tensile stress evolution inside the wire.

Original languageEnglish (US)
Title of host publication2023 IEEE International Reliability Physics Symposium, IRPS 2023 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781665456722
DOIs
StatePublished - 2023
Event61st IEEE International Reliability Physics Symposium, IRPS 2023 - Monterey, United States
Duration: Mar 26 2023Mar 30 2023

Publication series

NameIEEE International Reliability Physics Symposium Proceedings
Volume2023-March
ISSN (Print)1541-7026

Conference

Conference61st IEEE International Reliability Physics Symposium, IRPS 2023
Country/TerritoryUnited States
CityMonterey
Period3/26/233/30/23

Bibliographical note

Funding Information:
ACKNOWLEDGMENT This work was supported in part by Semiconductor Research Corporation (SRC) through the Texas Analog Center of Excellence (TxACE).

Publisher Copyright:
© 2023 IEEE.

Keywords

  • Electromigration
  • on-chip heater
  • power grid
  • reliability
  • temperature gradient
  • TTF
  • void

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