Wireless 3D vertical interconnect with power splitting capability

Aditya Dave; Rhonda Franklin

doi:10.1109/IMS30576.2020.9223936

Wireless 3D vertical interconnect with power splitting capability

Aditya Dave, Rhonda Franklin

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Scopus citations

Abstract

Power generation reduces at millimeter wave frequencies for emerging system applications, such as 5G. Thus, loss presents many design challenges for complex integrated system design. This paper proposes to alleviate loss associated with vertical interconnects used in such systems. A wireless equal split 3D vertical power divider that offers very low loss is presented. Two near field beams, produced by one source element and a novel frequency selective surface (FSS), are detected by individual receive elements of the same type. This design is scalable, modeled at 13.5GHz and 60GHz. A 13.5GHz scale model is demonstrated for validation. Simulated insertion loss coefficient at 13.5GHz is 3.24dB, with bandwidth of 5.5%. Modeled and measured results are in good agreement.

Original language	English (US)
Title of host publication	IMS 2020 - 2020 IEEE/MTT-S International Microwave Symposium
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	1161-1163
Number of pages	3
ISBN (Electronic)	9781728168159
DOIs	https://doi.org/10.1109/IMS30576.2020.9223936
State	Published - Aug 2020
Externally published	Yes
Event	2020 IEEE/MTT-S International Microwave Symposium, IMS 2020 - Virtual, Los Angeles, United States Duration: Aug 4 2020 → Aug 6 2020

Publication series

Name	IEEE MTT-S International Microwave Symposium Digest
Volume	2020-August
ISSN (Print)	0149-645X

Conference

Conference	2020 IEEE/MTT-S International Microwave Symposium, IMS 2020
Country/Territory	United States
City	Virtual, Los Angeles
Period	8/4/20 → 8/6/20

Bibliographical note

Publisher Copyright:
© 2020 IEEE.

Keywords

Frequency selective surface
Interconnects
Packaging
Power divider
Slot antennas
Wireless

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10.1109/IMS30576.2020.9223936

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Dave, A., & Franklin, R. (2020). Wireless 3D vertical interconnect with power splitting capability. In IMS 2020 - 2020 IEEE/MTT-S International Microwave Symposium (pp. 1161-1163). Article 9223936 (IEEE MTT-S International Microwave Symposium Digest; Vol. 2020-August). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IMS30576.2020.9223936

Wireless 3D vertical interconnect with power splitting capability. / Dave, Aditya; Franklin, Rhonda.
IMS 2020 - 2020 IEEE/MTT-S International Microwave Symposium. Institute of Electrical and Electronics Engineers Inc., 2020. p. 1161-1163 9223936 (IEEE MTT-S International Microwave Symposium Digest; Vol. 2020-August).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Dave, A & Franklin, R 2020, Wireless 3D vertical interconnect with power splitting capability. in IMS 2020 - 2020 IEEE/MTT-S International Microwave Symposium., 9223936, IEEE MTT-S International Microwave Symposium Digest, vol. 2020-August, Institute of Electrical and Electronics Engineers Inc., pp. 1161-1163, 2020 IEEE/MTT-S International Microwave Symposium, IMS 2020, Virtual, Los Angeles, United States, 8/4/20. https://doi.org/10.1109/IMS30576.2020.9223936

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abstract = "Power generation reduces at millimeter wave frequencies for emerging system applications, such as 5G. Thus, loss presents many design challenges for complex integrated system design. This paper proposes to alleviate loss associated with vertical interconnects used in such systems. A wireless equal split 3D vertical power divider that offers very low loss is presented. Two near field beams, produced by one source element and a novel frequency selective surface (FSS), are detected by individual receive elements of the same type. This design is scalable, modeled at 13.5GHz and 60GHz. A 13.5GHz scale model is demonstrated for validation. Simulated insertion loss coefficient at 13.5GHz is 3.24dB, with bandwidth of 5.5%. Modeled and measured results are in good agreement.",

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Wireless 3D vertical interconnect with power splitting capability

Abstract

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Bibliographical note

Keywords

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